Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12131986 | Semiconductor package and manufacturing method thereof | Tuan-Yu Hung, Hung-Jui Kuo, Kai-Chiang Wu, Ming-Che Ho | 2024-10-29 |
| 12046480 | Manufacturing method of a semiconductor device | Shou-Zen Chang, Chun-Lin Lu, Kai-Chiang Wu, Vincent Chen, Chuei-Tang Wang +3 more | 2024-07-23 |
| 11894330 | Methods of manufacturing a semiconductor device including a joint adjacent to a post | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang +2 more | 2024-02-06 |