Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183691 | Semiconductor structure and method of forming the same | Ching-Wen Chen, Hung-Jui Kuo | 2024-12-31 |
| 12176282 | Manufacturing method of semiconductor package | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh +7 more | 2024-12-24 |
| 12131986 | Semiconductor package and manufacturing method thereof | Tuan-Yu Hung, Ching-Feng Yang, Hung-Jui Kuo, Kai-Chiang Wu | 2024-10-29 |
| 12094830 | Integrated fan-out (InFO) package structure | Hung-Jui Kuo, Tzung-Hui Lee | 2024-09-17 |
| 11948890 | Semiconductor package and method | Shih-Hao Tseng, Hung-Jui Kuo | 2024-04-02 |
| 11935804 | Integrated circuit package and method | Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Hao-Yi Tsai, Chi-Ming Tsai +2 more | 2024-03-19 |
| 11901230 | Semiconductor package and manufacturing method thereof | Wei-Chung Chang, Hung-Jui Kuo | 2024-02-13 |