Issued Patents 2024
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176282 | Manufacturing method of semiconductor package | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Hung-Yi Kuo +7 more | 2024-12-24 |
| 12164158 | Package having prism structure and manufacturing method thereof | Che-Hsiang Hsu, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Hung-Yi Kuo +3 more | 2024-12-10 |
| 12132024 | Semiconductor package and method of manufacturing the same | Hao-Yi Tsai, Tzuan-Horng Liu, Tsung-Yuan Yu | 2024-10-29 |
| 12113031 | Semiconductor device and method of making the same | Hau Tao, Yung-Tien Kuo | 2024-10-08 |
| 12105323 | Semiconductor package | Chung-Ming Weng, Hua-Kuei Lin, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai +5 more | 2024-10-01 |
| 12040283 | Method of fabricating semiconductor structure | Tzu-Sung Huang, Hsiu-Jen Lin, Hui-Jung Tsai, Hung-Yi Kuo, Hao-Yi Tsai +4 more | 2024-07-16 |
| 12002799 | Die stacking structure and method forming same | Chen-Hua Yu, Hung-Yi Kuo, Chung-Shi Liu, Hao-Yi Tsai, Tsung-Yuan Yu +1 more | 2024-06-04 |
| 11953740 | Package structure | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Hung-Yi Kuo +3 more | 2024-04-09 |
| 11947173 | Photonic semiconductor device and method of manufacture | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Hung-Yi Kuo +3 more | 2024-04-02 |
| 11935871 | Semiconductor package and method of fabricating the same | Hao-Yi Tsai, Tsung-Hsien Chiang, Hui-Chun Chiang, Tzu-Sung Huang, Ming Hung Tseng +4 more | 2024-03-19 |
| 11901320 | Contact pad for semiconductor device | Chang-Chia Huang, Tsung-Shu Lin, Wei-Cheng Wu | 2024-02-13 |