Issued Patents 2024
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176319 | Reflow method and system | Cheng-Shiuan Wong, Ching-Hua Hsieh, Hao-Jan Pei, Hsuan-Ting Kuo, Wei-Yu Chen +2 more | 2024-12-24 |
| 12176282 | Manufacturing method of semiconductor package | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh +7 more | 2024-12-24 |
| 12159839 | Semiconductor packages | Tzu-Sung Huang, Hao-Yi Tsai, Ming Hung Tseng, Tsung-Hsien Chiang, Tin-Hao Kuo +1 more | 2024-12-03 |
| 12144065 | Warpage control in the packaging of integrated circuits | Ming-Da Cheng, Cheng-Ting Chen, Wei-Yu Chen, Chien-Wei Lee, Chung-Shi Liu | 2024-11-12 |
| 12142594 | Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices | Kuei-Wei Huang, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2024-11-12 |
| 12119238 | Semiconductor bonding structures and methods | Meng-Tse Chen, Wei-Hung Lin, Kuei-Wei Huang, Ming-Da Cheng, Chung-Shi Liu | 2024-10-15 |
| 12107064 | Semiconductor package and manufacturing method thereof | Jen-Jui Yu, Chih-Chiang Tsao, Hsuan-Ting Kuo, Mao-Yen Chang, Ching-Hua Hsieh +1 more | 2024-10-01 |
| 12086103 | Intelligent storage system and an intelligent storage method thereof | — | 2024-09-10 |
| 12051639 | Package structure and manufacturing method thereof | Chih-Chiang Tsao, Chao-Wei Chiu, Jen-Jui Yu, Ching-Hua Hsieh | 2024-07-30 |
| 12051655 | Package structure and method of forming the same | Jen-Jui Yu, Ching-Hua Hsieh, Cheng-Ting Chen, Wei-Yu Chen, Chih-Chiang Tsao +1 more | 2024-07-30 |
| 12040309 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Kuei-Wei Huang +4 more | 2024-07-16 |
| 12040283 | Method of fabricating semiconductor structure | Tzu-Sung Huang, Cheng-Chieh Hsieh, Hui-Jung Tsai, Hung-Yi Kuo, Hao-Yi Tsai +4 more | 2024-07-16 |
| 12009322 | Package structure with through-via in molding compound and dielectric layer | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Chih-Hua Chen +4 more | 2024-06-11 |
| 11996400 | Manufacturing method of package on package structure | Hsuan-Ting Kuo, Ching-Hua Hsieh, Cheng-Ting Chen, Hao-Jan Pei, Yu-Peng Tsai +3 more | 2024-05-28 |
| 11942464 | Semiconductor package and method | Hao-Jan Pei, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng, Kuei-Wei Huang +3 more | 2024-03-26 |
| 11942451 | Semiconductor structure and method of forming the same | Mao-Yen Chang, Yu-Chia Lai, Cheng-Shiuan Wong, Ting Hao Kuo, Ching-Hua Hsieh +2 more | 2024-03-26 |
| 11901258 | Iintegrated fan-out packages with embedded heat dissipation structure | Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen +4 more | 2024-02-13 |
| 11894332 | Substrate and package structure | Wei-Hung Lin, Ming-Da Cheng, Yu-Min Liang, Chen-Shien Chen, Chung-Shi Liu | 2024-02-06 |
| 11874513 | Package structure | Chia-Lun Chang, Ching-Hua Hsieh, Cheng-Ting Chen, Hsuan-Ting Kuo, Chia-Shen Cheng +1 more | 2024-01-16 |
| 11862577 | Package structure and method of fabricating the same | Hao-Jan Pei, Ching-Hua Hsieh, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao +2 more | 2024-01-02 |