Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119238 | Semiconductor bonding structures and methods | Hsiu-Jen Lin, Wei-Hung Lin, Kuei-Wei Huang, Ming-Da Cheng, Chung-Shi Liu | 2024-10-15 |
| 12057415 | Semiconductor device having antenna and manufacturing method thereof | Albert Wan, Ching-Hua Hsieh, Chao-Wen Shih, Han-Ping Pu, Sheng-Hsiang Chiu | 2024-08-06 |
| 12009345 | 3D package structure and methods of forming same | Chung-Shi Liu, Chih-Wei Lin, Hui-Min Huang, Hsuan-Ting Kuo, Ming-Da Cheng | 2024-06-11 |
| 11955460 | Advanced info POP and method of forming thereof | Yi-Da Tsai, Sheng-Feng Weng, Sheng-Hsiang Chiu, Wei-Hung Lin, Ming-Da Cheng +2 more | 2024-04-09 |