Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165985 | Semiconductor device and method | Chen-Hua Yu, Hui-Jung Tsai, Hung-Jui Kuo, Chung-Shi Liu, Ting-Chu Ko | 2024-12-10 |
| 12148735 | Memory device and manufacturing method thereof | Ching-Yu Huang, Ming-Kai Liu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang +1 more | 2024-11-19 |
| 12132247 | Semiconductor package and manufacturing method thereof | Yen-Ping Wang, Chun-Lin Lu, Kai-Chiang Wu, Chung-Yi Hsu | 2024-10-29 |
| 12119303 | Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof | Chen-Hua Yu, Chun-Lin Lu, Kai-Chiang Wu | 2024-10-15 |
| 12062622 | Integrated fan-out packaging | Hsiao-Wen Lee | 2024-08-13 |
| 12057415 | Semiconductor device having antenna and manufacturing method thereof | Albert Wan, Ching-Hua Hsieh, Chao-Wen Shih, Meng-Tse Chen, Sheng-Hsiang Chiu | 2024-08-06 |
| 11929319 | Integrated fan-out packages and methods of forming the same | Ching-Yu Huang, Ming-Kai Liu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang +1 more | 2024-03-12 |
| 11894299 | Conductive traces in semiconductor devices and methods of forming same | Chao-Wen Shih, Chen-Hua Yu, Hsin-Yu Pan, Hao-Yi Tsai, Sen-Kuei Hsu | 2024-02-06 |