Issued Patents 2024
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176279 | Package structure and manufacturing method thereof | Sung-Yueh Wu, Chien Ling Hwang, Jen-Chun Liao, Pei-Hsuan Lee, Chia-Hung Liu | 2024-12-24 |
| 12176319 | Reflow method and system | Cheng-Shiuan Wong, Hsiu-Jen Lin, Hao-Jan Pei, Hsuan-Ting Kuo, Wei-Yu Chen +2 more | 2024-12-24 |
| 12176299 | Semiconductor device and manufacturing method thereof | Yu-Wei Lin, Chun-Yen Lan, Tzu-Ting Chou, Tzu-Shiun Sheu, Chih-Wei Lin +2 more | 2024-12-24 |
| 12125797 | Package structure with fan-out feature | Shing-Chao Chen, Chih-Wei Lin, Tsung-Hsien Chiang, Ming-Da Cheng | 2024-10-22 |
| 12107064 | Semiconductor package and manufacturing method thereof | Jen-Jui Yu, Chih-Chiang Tsao, Hsuan-Ting Kuo, Mao-Yen Chang, Hsiu-Jen Lin +1 more | 2024-10-01 |
| 12080653 | Formation method of chip package with fan-out structure | Shing-Chao Chen, Chih-Wei Lin, Tsung-Hsien Chiang, Ming-Da Cheng | 2024-09-03 |
| 12062832 | Electronic device and manufacturing method thereof | Pei-Hsuan Lee, Chien Ling Hwang, Yu-Ting Chiu, Jui-Chang Kuo | 2024-08-13 |
| 12057415 | Semiconductor device having antenna and manufacturing method thereof | Albert Wan, Chao-Wen Shih, Han-Ping Pu, Meng-Tse Chen, Sheng-Hsiang Chiu | 2024-08-06 |
| 12057359 | Semiconductor package and method of fabricating the same | Chun-Cheng Lin, Chen-Hua Yu, Chung-Shi Liu, Chih-Wei Lin | 2024-08-06 |
| 12051655 | Package structure and method of forming the same | Jen-Jui Yu, Cheng-Ting Chen, Hsiu-Jen Lin, Wei-Yu Chen, Chih-Chiang Tsao +1 more | 2024-07-30 |
| 12051639 | Package structure and manufacturing method thereof | Chih-Chiang Tsao, Chao-Wei Chiu, Jen-Jui Yu, Hsiu-Jen Lin | 2024-07-30 |
| 12040247 | Package system and manufacturing method thereof | Pei-Hsuan Lee, Chien Ling Hwang | 2024-07-16 |
| 12040255 | Semiconductor package and manufacturing method thereof | Jen-Chun Liao, Sung-Yueh Wu, Chien Ling Hwang | 2024-07-16 |
| 12040309 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Kuei-Wei Huang +4 more | 2024-07-16 |
| 12033992 | Package and manufacturing method thereof | Shing-Chao Chen, Chih-Wei Lin, Sheng-Chieh Yang | 2024-07-09 |
| 12021037 | Method for manufacturing package structure | Yi-Da Tsai, Cheng Ping Lin, Wei-Hung Lin, Chih-Wei Lin, Ming-Da Cheng +1 more | 2024-06-25 |
| 12011859 | Molding apparatus and manufacturing method of molded semiconductor device | Sheng-Feng Weng, Chung-Shi Liu, Chih-Wei Lin, Sheng-Hsiang Chiu, Yao-Tong Lai +1 more | 2024-06-18 |
| 12009322 | Package structure with through-via in molding compound and dielectric layer | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin +4 more | 2024-06-11 |
| 11996400 | Manufacturing method of package on package structure | Hsuan-Ting Kuo, Cheng-Ting Chen, Hsiu-Jen Lin, Hao-Jan Pei, Yu-Peng Tsai +3 more | 2024-05-28 |
| 11993066 | Chuck, lamination process, and manufacturing method of semiconductor package using the same | Wei Huang, Yu-Ching Lo, Ching-Pin Yuan, Wen-Chih Lin, Cheng-Yu Kuo +1 more | 2024-05-28 |
| 11955460 | Advanced info POP and method of forming thereof | Yi-Da Tsai, Meng-Tse Chen, Sheng-Feng Weng, Sheng-Hsiang Chiu, Wei-Hung Lin +2 more | 2024-04-09 |
| 11942451 | Semiconductor structure and method of forming the same | Mao-Yen Chang, Yu-Chia Lai, Cheng-Shiuan Wong, Ting Hao Kuo, Hao-Yi Tsai +2 more | 2024-03-26 |
| 11942464 | Semiconductor package and method | Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng +3 more | 2024-03-26 |
| 11901258 | Iintegrated fan-out packages with embedded heat dissipation structure | Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen +4 more | 2024-02-13 |
| 11878388 | Polishing pad, polishing apparatus and method of manufacturing semiconductor package using the same | Kuan-Cheng Wang, Yi-Yang Lei | 2024-01-23 |