Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176279 | Package structure and manufacturing method thereof | Sung-Yueh Wu, Chien Ling Hwang, Ching-Hua Hsieh, Pei-Hsuan Lee, Chia-Hung Liu | 2024-12-24 |
| 12040255 | Semiconductor package and manufacturing method thereof | Sung-Yueh Wu, Chien Ling Hwang, Ching-Hua Hsieh | 2024-07-16 |