Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176279 | Package structure and manufacturing method thereof | Sung-Yueh Wu, Chien Ling Hwang, Jen-Chun Liao, Ching-Hua Hsieh, Chia-Hung Liu | 2024-12-24 |
| 12165975 | Method of forming interconnect structure having a barrier layer | Shu-Cheng Chin, Ming-Yuan Gao, Chen-Yi Niu, Yen-Chun Lin, Hsin-Ying Peng +4 more | 2024-12-10 |
| 12159830 | Nitrogen plasma treatment for improving interface between etch stop layer and copper interconnect | Hui-Chun LEE, Po-Hsiang Huang, Wen-Sheh Huang, Jen Hung Wang, Su-Jen Sung +1 more | 2024-12-03 |
| 12062832 | Electronic device and manufacturing method thereof | Ching-Hua Hsieh, Chien Ling Hwang, Yu-Ting Chiu, Jui-Chang Kuo | 2024-08-13 |
| 12061229 | In-line electrical detection of defects at wafer level | Yu-Hsuan Huang, Chien-Liang Chen | 2024-08-13 |
| 12040247 | Package system and manufacturing method thereof | Ching-Hua Hsieh, Chien Ling Hwang | 2024-07-16 |
| 11990381 | Integrated circuit packages having support rings | Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Chien Ling Hwang +3 more | 2024-05-21 |
| 11984365 | Semiconductor structure inspection using a high atomic number material | Hung-Ming Chen, Kuang-Shing Chen, Yu-Hsiang Cheng, Xiaomeng Chen | 2024-05-14 |