Issued Patents 2024
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165947 | Semiconductor devices and method for forming the same | Yung-Shih Cheng, Jiing-Feng Yang, Yu-Hsiang Chen, Chii-Ping Chen | 2024-12-10 |
| 12159830 | Nitrogen plasma treatment for improving interface between etch stop layer and copper interconnect | Hui-Chun LEE, Po-Hsiang Huang, Jen Hung Wang, Su-Jen Sung, Chih-Chien Chi +1 more | 2024-12-03 |
| 12119262 | Semiconductor device structure with resistive element | Hsiu-Wen Hsueh, Yu-Hsiang Chen, Chii-Ping Chen | 2024-10-15 |
| 12074107 | Structure and method of forming a semiconductor device with resistive elements | Hong-Wei Chan, Yung-Shih Cheng | 2024-08-27 |
| 12068377 | Back-end-of-line devices | Yu-Hsiang Chen, Po-Hsiang Huang, Hsing-Leo Tsai, Chia-En Huang | 2024-08-20 |
| 12040178 | Method for manufacturing semiconductor structure with resistive elements | Hsiu-Wen Hsueh, Yu-Hsiang Chen, Chii-Ping Chen, Wan-Te Chen | 2024-07-16 |
| 11942390 | Thermal dissipation in semiconductor devices | Yu-Hsiang Chen, Chii-Ping Chen | 2024-03-26 |
| 11923295 | Interconnect level with high resistance layer and method of forming the same | Hong-Wei Chan, Yung-Shih Cheng, Yu-Hsiang Chen | 2024-03-05 |
| 11901289 | Semiconductor device structure with resistive element | Wan-Te Chen, Chung-Hui Chen, Wei-Chih Chen, Chii-Ping Chen, Bi-Ling Lin +1 more | 2024-02-13 |