Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159830 | Nitrogen plasma treatment for improving interface between etch stop layer and copper interconnect | Hui-Chun LEE, Po-Hsiang Huang, Wen-Sheh Huang, Jen Hung Wang, Chih-Chien Chi +1 more | 2024-12-03 |
| 12094930 | Integrated circuit structure and method for forming the same | Guan-Yao Tu, Tze-Liang Lee, Hong-Wei Chan | 2024-09-17 |
| 12046557 | Interconnect structure and method of forming same | — | 2024-07-23 |
| 11923304 | Electro-migration barrier for interconnect | Chih-Chiang Chang, Chia-Ho Chen | 2024-03-05 |