Issued Patents 2024
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159830 | Nitrogen plasma treatment for improving interface between etch stop layer and copper interconnect | Hui-Chun LEE, Wen-Sheh Huang, Jen Hung Wang, Su-Jen Sung, Chih-Chien Chi +1 more | 2024-12-03 |
| 12159791 | Info packages including thermal dissipation blocks | Ching-Yi Lin, Yu-Hao Chen, Fong-Yuan Chang, Jyh Chwen Frank Lee, Shuo-Mao Chen | 2024-12-03 |
| 12154842 | Heat dissipation structures for three-dimensional system on integrated chip structure | Chin-Chou Liu, Chin-Her Chien, Fong-Yuan Chang, Hui Yu Lee | 2024-11-26 |
| 12087690 | Integrated circuit having a high cell density | Sheng-Hsiung Chen, Chung-Hsing Wang, Fong-Yuan Chang, Lee-Chung Lu, Li-Chun Tien +6 more | 2024-09-10 |
| 12079561 | Cell region including portion of conductor of another cell region and semiconductor device include the same | Fong-Yuan Chang, Chin-Chou Liu, Sheng-Hsiung Chen | 2024-09-03 |
| 12074148 | Heat dissipation in semiconductor packages and methods of forming same | Fong-Yuan Chang, Lee-Chung Lu, Jyh Chwen Frank Lee, Yii-Chian Lu, Yu-Hao Chen +1 more | 2024-08-27 |
| 12068377 | Back-end-of-line devices | Yu-Hsiang Chen, Wen-Sheh Huang, Hsing-Leo Tsai, Chia-En Huang | 2024-08-20 |
| 12062641 | Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing same | Chih-Lin Chen, Hui Yu Lee, Fong-Yuan Chang, Chin-Chou Liu | 2024-08-13 |
| 12056432 | Pin modification for standard cells | Fong-Yuan Chang, Chun-Chen Chen, Sheng-Hsiung Chen, Ting-Wei Chiang, Chung-Te Lin +2 more | 2024-08-06 |
| 12056049 | Out-of-order buffer and associated management method | Jyun-Yan Li, Ya-Ting Chen, Yao-An Tsai, Shu Yi | 2024-08-06 |
| 12046506 | Devices with reduced capacitances | Yu-Hsin Chan, Cai-Ling Wu, Chang-Wen Chen, Yu-Yu Chen, Kuan-Wei Huang +3 more | 2024-07-23 |
| 12027513 | Layout design methodology for stacked devices | Fong-Yuan Chang, Chin-Chou Liu, Chin-Her Chien, Ka Fai Chang | 2024-07-02 |
| 12002776 | Interconnect structure and method for forming the same | Jung-Chou Tsai, Fong-Yuan Chang, Chin-Chou Liu, Yi-Kan Cheng | 2024-06-04 |
| 11983475 | Method for manufacturing a cell having pins and semiconductor device based on same | Pin-Dai Sue, Fong-Yuan Chang, Chi-Yu Lu, Sheng-Hsiung Chen, Chin-Chou Liu +4 more | 2024-05-14 |
| 11978410 | Backlight control method and related display driver circuit for variable refresh rate display panel | Chung-Wen Wu, Jiun-Yi Lin, Wen-Chi Lin | 2024-05-07 |
| 11967591 | Info packages including thermal dissipation blocks | Yu-Hao Chen, Fong-Yuan Chang, Ching-Yi Lin, Jyh Chwen Frank Lee | 2024-04-23 |
| 11935894 | Integrated circuit device with improved layout | Fong-Yuan Chang, Chun-Chen Chen, Lee-Chung Lu, Chung-Te Lin, Jerry Chang Jui Kao +2 more | 2024-03-19 |
| 11923271 | 3D IC power grid | Noor Mohamed, Fong-Yuan Chang, Chin-Chou Liu | 2024-03-05 |
| 11923302 | Semiconductor device and method of manufacture | Fong-Yuan Chang, Noor Mohamed Ettuveettil, Sen-Bor Jan, Ming-Fa Chen, Chin-Chou Liu +1 more | 2024-03-05 |
| 11908853 | Integrated circuit and method of generating integrated circuit layout | Fong-Yuan Chang, Kuo-Nan Yang, Chung-Hsing Wang, Lee-Chung Lu, Sheng-Fong Chen +3 more | 2024-02-20 |
| 11901228 | Self-aligned scheme for semiconductor device and method of forming the same | Cai-Ling Wu, Hsiu-Wen Hsueh, Wei-Ren Wang, Chii-Ping Chen, Jen Hung Wang | 2024-02-13 |
| 11861282 | Integrated circuit fin structure manufacturing method | Fong-Yuan Chang, Clement Hsingjen Wann, Chih-Hsin Ko, Sheng-Hsiung Chen, Li-Chun Tien +1 more | 2024-01-02 |