Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12074148 | Heat dissipation in semiconductor packages and methods of forming same | Fong-Yuan Chang, Po-Hsiang Huang, Lee-Chung Lu, Jyh Chwen Frank Lee, Yu-Hao Chen +1 more | 2024-08-27 |