Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159791 | Info packages including thermal dissipation blocks | Ching-Yi Lin, Yu-Hao Chen, Fong-Yuan Chang, Po-Hsiang Huang, Shuo-Mao Chen | 2024-12-03 |
| 12074148 | Heat dissipation in semiconductor packages and methods of forming same | Fong-Yuan Chang, Po-Hsiang Huang, Lee-Chung Lu, Yii-Chian Lu, Yu-Hao Chen +1 more | 2024-08-27 |
| 11967591 | Info packages including thermal dissipation blocks | Yu-Hao Chen, Fong-Yuan Chang, Po-Hsiang Huang, Ching-Yi Lin | 2024-04-23 |
| 11929340 | Arrangement of power-grounds in package structures | Ting-Yu Yeh, Chun Hua Chang, Fong-Yuan Chang | 2024-03-12 |