Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062590 | Method for manufacturing semiconductor package structure | Chia-Hao Hsu, Weiming Chris Chen, Kuo-Chiang Ting, Tu-Hao Yu, Shang-Yun Hou | 2024-08-13 |
| 11990351 | Semiconductor package and manufacturing method thereof | Jiun-Ting Chen, Chih-Wei Wu, Szu-Wei Lu, Tsung-Fu Tsai, Ying-Ching Shih +1 more | 2024-05-21 |
| 11978714 | Encapsulated package including device dies connected via interconnect die | Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Chia-Hao Hsu | 2024-05-07 |
| 11929340 | Arrangement of power-grounds in package structures | Chun Hua Chang, Fong-Yuan Chang, Jyh Chwen Frank Lee | 2024-03-12 |