Issued Patents 2024
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087664 | Semiconductor package having liquid-cooling lid | Tai-Yu Chen, Sheng-Liang Kuo, Bo-Jiun Yang | 2024-09-10 |
| 12080638 | Semiconductor device and method for manufacturing the same | Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Pin-Tso Lin +1 more | 2024-09-03 |
| 12062590 | Method for manufacturing semiconductor package structure | Ting-Yu Yeh, Weiming Chris Chen, Kuo-Chiang Ting, Tu-Hao Yu, Shang-Yun Hou | 2024-08-13 |
| 11978714 | Encapsulated package including device dies connected via interconnect die | Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Ting-Yu Yeh | 2024-05-07 |
| D1025864 | Vehicle interior | Tse-Min Cheng, Lu-Han Lee | 2024-05-07 |
| 11967570 | Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure | Tai-Yu Chen, Shiann-Tsong Tsai, Hsing-Chih Liu, Yao-Pang Hsu, Chi-Yuan Chen +1 more | 2024-04-23 |
| 11927991 | Synchronized hinges for foldable displays | Christopher A. Torres, Enoch Chen, Anthony J. Sanchez, Hsu-Hong Yao, Mo-Yu Zhang | 2024-03-12 |
| 11908767 | Semiconductor package structure | Che-Hung Kuo, Hsing-Chih Liu | 2024-02-20 |
| 11907027 | Gear synchronized dual axis pivot hinge | Christopher A. Torres, Kevin M. Turchin, Enoch Chen, Anthony J. Sanchez, Kai-Cheng Chao +1 more | 2024-02-20 |