Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087664 | Semiconductor package having liquid-cooling lid | Chia-Hao Hsu, Tai-Yu Chen, Sheng-Liang Kuo | 2024-09-10 |
| 12021068 | Semiconductor device with dummy thermal features on interposer | Wen-Sung Hsu, Tai-Yu Chen, Shih-Chin Lin, Kun-Ting Hung | 2024-06-25 |