Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136597 | Semiconductor package having an interposer in which one or more dies are formed and method of forming the same | Yi-Lin Tsai, Nai-Wei Liu | 2024-11-05 |
| 12080614 | Lidded semiconductor package | Shih-Chao Chiu, Chi-Yuan Chen, Ya-Jui Hsieh, Yao-Pang Hsu, Wen-Chun Huang | 2024-09-03 |
| 12021031 | Semiconductor package structure | Yi-Lin Tsai, Yi-Jou Lin, I-Hsuan Peng | 2024-06-25 |
| 12021068 | Semiconductor device with dummy thermal features on interposer | Bo-Jiun Yang, Tai-Yu Chen, Shih-Chin Lin, Kun-Ting Hung | 2024-06-25 |