Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136597 | Semiconductor package having an interposer in which one or more dies are formed and method of forming the same | Yi-Lin Tsai, Wen-Sung Hsu | 2024-11-05 |
| 11948895 | Semiconductor package structure | Tzu-Hung Lin, Chia-Cheng Chang, I-Hsuan Peng | 2024-04-02 |