Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154848 | Electronic package and manufacturing method thereof, and substrate structure | Chia-Wen Tsao, Wen-Chen Hsieh, Hsiu-Fang Chien | 2024-11-26 |
| 12140863 | Imprint method | Su-Yun Fang, Chih-Hsien Tang | 2024-11-12 |
| 12136597 | Semiconductor package having an interposer in which one or more dies are formed and method of forming the same | Nai-Wei Liu, Wen-Sung Hsu | 2024-11-05 |
| 12021031 | Semiconductor package structure | Yi-Jou Lin, I-Hsuan Peng, Wen-Sung Hsu | 2024-06-25 |
| 11881142 | Image brightness adjusting method and image brightness adjusting device | Yi Li, Chun-Hsing Hsieh | 2024-01-23 |