Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154848 | Electronic package and manufacturing method thereof, and substrate structure | Chia-Wen Tsao, Wen-Chen Hsieh, Yi-Lin Tsai | 2024-11-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154848 | Electronic package and manufacturing method thereof, and substrate structure | Chia-Wen Tsao, Wen-Chen Hsieh, Yi-Lin Tsai | 2024-11-26 |