Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142598 | Semiconductor package structure having an annular frame with truncated corners | Tzu-Hung Lin, I-Hsuan Peng, Yi-Jou Lin | 2024-11-12 |
| 11948895 | Semiconductor package structure | Tzu-Hung Lin, I-Hsuan Peng, Nai-Wei Liu | 2024-04-02 |
| 11862578 | Semiconductor package structure | Tzu-Hung Lin, I-Hsuan Peng, Yi-Jou Lin | 2024-01-02 |