Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087664 | Semiconductor package having liquid-cooling lid | Chia-Hao Hsu, Tai-Yu Chen, Bo-Jiun Yang | 2024-09-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087664 | Semiconductor package having liquid-cooling lid | Chia-Hao Hsu, Tai-Yu Chen, Bo-Jiun Yang | 2024-09-10 |