Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165961 | Semiconductor package structure | Hsing-Chih Liu, Zheng Zeng | 2024-12-10 |
| 12021013 | Ball pad design for semiconductor packages | Chiang-Lin Yen | 2024-06-25 |
| 11908759 | Semiconductor device | Nan-Cheng Chen, Che-Ya Chou, Hsing-Chih Liu | 2024-02-20 |
| 11908767 | Semiconductor package structure | Hsing-Chih Liu, Chia-Hao Hsu | 2024-02-20 |
| 11887976 | Land-side silicon capacitor design and semiconductor package using the same | Yi-Jyun Lee | 2024-01-30 |