Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080638 | Semiconductor device and method for manufacturing the same | Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Chia-Hao Hsu, Pin-Tso Lin +1 more | 2024-09-03 |
| 12062590 | Method for manufacturing semiconductor package structure | Ting-Yu Yeh, Chia-Hao Hsu, Weiming Chris Chen, Kuo-Chiang Ting, Shang-Yun Hou | 2024-08-13 |
| 11978714 | Encapsulated package including device dies connected via interconnect die | Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Chia-Hao Hsu, Ting-Yu Yeh | 2024-05-07 |