Issued Patents 2024
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165992 | Package structure and fabricating method thereof | Kuan-Yu Huang, Sung-Hui Huang | 2024-12-10 |
| 12148719 | Forming large chips through stitching | Wen-Hsin Wei, Hsien-Pin Hu, Weiming Chris Chen | 2024-11-19 |
| 12148678 | Semiconductor package and manufacturing method thereof | Wen-Wei Shen, Sung-Hui Huang, Kuan-Yu Huang | 2024-11-19 |
| 12124078 | Photonic silicon spatial beam transformer integrated on 3DIC package and methods for forming the same | Kuan-Yu Huang, Yu-Yun Huang, Tien-Yu Huang, Sung-Hui Huang, Sen-Bor Jan | 2024-10-22 |
| 12087727 | Joint structure in semiconductor package and manufacturing method thereof | Kuan-Yu Huang, Chih-Wei Wu, Sung-Hui Huang, Ying-Ching Shih, Cheng-Chieh Li | 2024-09-10 |
| 12087733 | Packages with multiple types of underfill and method forming the same | Kuan-Yu Huang, Li-Chung Kuo, Sung-Hui Huang | 2024-09-10 |
| 12080638 | Semiconductor device and method for manufacturing the same | Kuo-Chiang Ting, Chi-Hsi Wu, Tu-Hao Yu, Chia-Hao Hsu, Pin-Tso Lin +1 more | 2024-09-03 |
| 12080681 | Package structure and method of fabricating the same | Wen-Wei Shen, Sung-Hui Huang | 2024-09-03 |
| 12062590 | Method for manufacturing semiconductor package structure | Ting-Yu Yeh, Chia-Hao Hsu, Weiming Chris Chen, Kuo-Chiang Ting, Tu-Hao Yu | 2024-08-13 |
| 12051668 | Semiconductor package and method of forming the same | Kuan-Yu Huang, Li-Chung Kuo, Sung-Hui Huang, Tsung-Yu Chen, Chien-Yuan Huang | 2024-07-30 |
| 12038599 | Photonic package and method of manufacture | Chen-Hua Yu, Hsing-Kuo Hsia, Kuo-Chiang Ting, Jiun Yi Wu, Hung-Yi Kuo | 2024-07-16 |
| 12033969 | Chip package structure | Kuan-Yu Huang, Sung-Hui Huang | 2024-07-09 |
| 12027455 | Chip-on-wafer structure with Chiplet Interposer | Weiming Chris Chen, Kuo-Chiang Ting | 2024-07-02 |
| 12015023 | Integrated circuit package and method of forming same | Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin, Heh-Chang Huang +8 more | 2024-06-18 |
| 12002721 | Method of fabricating semiconductor structure | Kuan-Yu Huang, Sung-Hui Huang, Chien-Yuan Huang | 2024-06-04 |
| 11996371 | Chiplet interposer | Weiming Chris Chen, Kuo-Chiang Ting, Hsien-Pin Hu, Wen-Chih Chiou, Chen-Hua Yu | 2024-05-28 |
| 11990443 | Semiconductor die package and method of manufacture | Kuan-Yu Huang, Sung-Hui Huang, Shu-Chia Hsu, Yu-Yun Huang, Wen-Yao Chang +1 more | 2024-05-21 |
| 11978714 | Encapsulated package including device dies connected via interconnect die | Kuo-Chiang Ting, Chi-Hsi Wu, Tu-Hao Yu, Chia-Hao Hsu, Ting-Yu Yeh | 2024-05-07 |
| 11967546 | Giga interposer integration through Chip-On-Wafer-On-Substrate | Hsien-Pin Hu, Sao-Ling Chiu, Wen-Hsin Wei, Ping-Kang Huang, Chih-Ta Shen +5 more | 2024-04-23 |
| 11916009 | Semiconductor package and manufacturing method thereof | Chi-Ming Huang, Ping-Kang Huang, Sao-Ling Chiu | 2024-02-27 |