Issued Patents 2024
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165992 | Package structure and fabricating method thereof | Sung-Hui Huang, Shang-Yun Hou | 2024-12-10 |
| 12165990 | Semiconductor device | Sung-Hui Huang, Pai Yuan Li, Shu-Chia Hsu, Hsiang-Fan Lee, Szu-Po Huang | 2024-12-10 |
| 12148678 | Semiconductor package and manufacturing method thereof | Wen-Wei Shen, Sung-Hui Huang, Shang-Yun Hou | 2024-11-19 |
| 12124078 | Photonic silicon spatial beam transformer integrated on 3DIC package and methods for forming the same | Yu-Yun Huang, Tien-Yu Huang, Sung-Hui Huang, Sen-Bor Jan, Shang-Yun Hou | 2024-10-22 |
| 12087727 | Joint structure in semiconductor package and manufacturing method thereof | Chih-Wei Wu, Sung-Hui Huang, Shang-Yun Hou, Ying-Ching Shih, Cheng-Chieh Li | 2024-09-10 |
| 12087733 | Packages with multiple types of underfill and method forming the same | Li-Chung Kuo, Sung-Hui Huang, Shang-Yun Hou | 2024-09-10 |
| 12080617 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Li-Chung Kuo, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin +1 more | 2024-09-03 |
| 12051668 | Semiconductor package and method of forming the same | Li-Chung Kuo, Sung-Hui Huang, Shang-Yun Hou, Tsung-Yu Chen, Chien-Yuan Huang | 2024-07-30 |
| 12033969 | Chip package structure | Sung-Hui Huang, Shang-Yun Hou | 2024-07-09 |
| 12015023 | Integrated circuit package and method of forming same | Shang-Yun Hou, Sung-Hui Huang, Hsien-Pin Hu, Yushun Lin, Heh-Chang Huang +8 more | 2024-06-18 |
| 12002721 | Method of fabricating semiconductor structure | Sung-Hui Huang, Shang-Yun Hou, Chien-Yuan Huang | 2024-06-04 |
| 11990443 | Semiconductor die package and method of manufacture | Sung-Hui Huang, Shang-Yun Hou, Shu-Chia Hsu, Yu-Yun Huang, Wen-Yao Chang +1 more | 2024-05-21 |
| 11916023 | Thermal interface material having different thicknesses in packages | Sung-Hui Huang, Da-Cyuan Yu, Pai Yuan Li, Hsiang-Fan Lee | 2024-02-27 |