DY

Da-Cyuan Yu

TSMC: 1 patents #2,264 of 4,162Top 55%
Overall (2024): #488,689 of 561,600Top 90%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11916023 Thermal interface material having different thicknesses in packages Sung-Hui Huang, Kuan-Yu Huang, Pai Yuan Li, Hsiang-Fan Lee 2024-02-27