Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165990 | Semiconductor device | Kuan-Yu Huang, Sung-Hui Huang, Shu-Chia Hsu, Hsiang-Fan Lee, Szu-Po Huang | 2024-12-10 |
| 11916023 | Thermal interface material having different thicknesses in packages | Sung-Hui Huang, Da-Cyuan Yu, Kuan-Yu Huang, Hsiang-Fan Lee | 2024-02-27 |