Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165990 | Semiconductor device | Kuan-Yu Huang, Sung-Hui Huang, Pai Yuan Li, Hsiang-Fan Lee, Szu-Po Huang | 2024-12-10 |
| 11990443 | Semiconductor die package and method of manufacture | Kuan-Yu Huang, Sung-Hui Huang, Shang-Yun Hou, Yu-Yun Huang, Wen-Yao Chang +1 more | 2024-05-21 |