Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11990443 | Semiconductor die package and method of manufacture | Kuan-Yu Huang, Sung-Hui Huang, Shang-Yun Hou, Shu-Chia Hsu, Yu-Yun Huang +1 more | 2024-05-21 |
WC
Wen-Yao Chang
Overall (2024): #225,539 of 561,600Top 45%
1
Patents 2024