Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165990 | Semiconductor device | Kuan-Yu Huang, Sung-Hui Huang, Pai Yuan Li, Shu-Chia Hsu, Szu-Po Huang | 2024-12-10 |
| 11961779 | 3DIC packaging with hot spot thermal management features | Wensen Hung, Szu-Po Huang, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2024-04-16 |
| 11916023 | Thermal interface material having different thicknesses in packages | Sung-Hui Huang, Da-Cyuan Yu, Kuan-Yu Huang, Pai Yuan Li | 2024-02-27 |