KC

Kim Hong Chen

TSMC: 1 patents #2,264 of 4,162Top 55%
📍 Fremont, CA: #749 of 1,881 inventorsTop 40%
🗺 California: #26,178 of 67,048 inventorsTop 40%
Overall (2024): #383,409 of 561,600Top 70%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11961779 3DIC packaging with hot spot thermal management features Wensen Hung, Szu-Po Huang, Hsiang-Fan Lee, Chi-Hsi Wu, Shin-Puu Jeng 2024-04-16