Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170237 | Semiconductor structure and manufacturing method thereof | Ping-Kang Huang, Sao-Ling Chiu, Tsung-Yu Chen, Tsung-Shu Lin, Chien-Yuan Huang +1 more | 2024-12-17 |
| 12125757 | Semiconductor package with stiffener structure and method forming the same | Yu-Ling Tsai, Chien-Chia Chiu, Tsung-Yu Chen | 2024-10-22 |
| 12094836 | Semiconductor device having heat dissipation structure of curved profile and a manufacturing method thereof | Hsuan-Ning Shih, Hsien-Pin Hu, Tsung-Shu Lin, Tsung-Yu Chen, Wen-Hsin Wei | 2024-09-17 |
| 12074154 | Package structure | Tsung-Shu Lin, Tsung-Yu Chen | 2024-08-27 |
| 12021006 | Package structure and method and equipment for forming the same | Tsung-Yu Chen, Tsung-Shu Lin, Chen-Hsiang Lao, Wen-Hsin Wei, Hsien-Pin Hu | 2024-06-25 |
| 11961779 | 3DIC packaging with hot spot thermal management features | Szu-Po Huang, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2024-04-16 |
| 11929293 | Semiconductor package with lid structure | Tsung-Shu Lin, Tsung-Yu Chen | 2024-03-12 |