Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170237 | Semiconductor structure and manufacturing method thereof | Wensen Hung, Ping-Kang Huang, Sao-Ling Chiu, Tsung-Shu Lin, Chien-Yuan Huang +1 more | 2024-12-17 |
| 12125757 | Semiconductor package with stiffener structure and method forming the same | Wensen Hung, Yu-Ling Tsai, Chien-Chia Chiu | 2024-10-22 |
| 12094836 | Semiconductor device having heat dissipation structure of curved profile and a manufacturing method thereof | Wensen Hung, Hsuan-Ning Shih, Hsien-Pin Hu, Tsung-Shu Lin, Wen-Hsin Wei | 2024-09-17 |
| 12074154 | Package structure | Tsung-Shu Lin, Wensen Hung | 2024-08-27 |
| 12051668 | Semiconductor package and method of forming the same | Kuan-Yu Huang, Li-Chung Kuo, Sung-Hui Huang, Shang-Yun Hou, Chien-Yuan Huang | 2024-07-30 |
| 12021006 | Package structure and method and equipment for forming the same | Wensen Hung, Tsung-Shu Lin, Chen-Hsiang Lao, Wen-Hsin Wei, Hsien-Pin Hu | 2024-06-25 |
| 11929293 | Semiconductor package with lid structure | Tsung-Shu Lin, Wensen Hung | 2024-03-12 |
| 11923310 | Package structure including through via structures | Chih-Kai Cheng, Tsung-Shu Lin, Hsien-Pin Hu, Wen-Hsin Wei | 2024-03-05 |