Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170237 | Semiconductor structure and manufacturing method thereof | Wensen Hung, Ping-Kang Huang, Sao-Ling Chiu, Tsung-Yu Chen, Tsung-Shu Lin +1 more | 2024-12-17 |
| 12021006 | Package structure and method and equipment for forming the same | Wensen Hung, Tsung-Yu Chen, Tsung-Shu Lin, Wen-Hsin Wei, Hsien-Pin Hu | 2024-06-25 |
| 11996342 | Semiconductor package comprising heat dissipation plates | Yuan Sheng Chiu, Hung-Chi Li, Shih-Chang Ku, Tsung-Shu Lin | 2024-05-28 |