Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148719 | Forming large chips through stitching | Wen-Hsin Wei, Shang-Yun Hou, Weiming Chris Chen | 2024-11-19 |
| 12094836 | Semiconductor device having heat dissipation structure of curved profile and a manufacturing method thereof | Wensen Hung, Hsuan-Ning Shih, Tsung-Shu Lin, Tsung-Yu Chen, Wen-Hsin Wei | 2024-09-17 |
| 12021006 | Package structure and method and equipment for forming the same | Wensen Hung, Tsung-Yu Chen, Tsung-Shu Lin, Chen-Hsiang Lao, Wen-Hsin Wei | 2024-06-25 |
| 12015023 | Integrated circuit package and method of forming same | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Yushun Lin, Heh-Chang Huang +8 more | 2024-06-18 |
| 11996371 | Chiplet interposer | Shang-Yun Hou, Weiming Chris Chen, Kuo-Chiang Ting, Wen-Chih Chiou, Chen-Hua Yu | 2024-05-28 |
| 11967546 | Giga interposer integration through Chip-On-Wafer-On-Substrate | Shang-Yun Hou, Sao-Ling Chiu, Wen-Hsin Wei, Ping-Kang Huang, Chih-Ta Shen +5 more | 2024-04-23 |
| 11923310 | Package structure including through via structures | Chih-Kai Cheng, Tsung-Shu Lin, Tsung-Yu Chen, Wen-Hsin Wei | 2024-03-05 |