Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080623 | Integrated circuit packages having mechanical brace standoffs | Yuan Sheng Chiu, Tsung-Shu Lin | 2024-09-03 |
| 11923310 | Package structure including through via structures | Tsung-Shu Lin, Tsung-Yu Chen, Hsien-Pin Hu, Wen-Hsin Wei | 2024-03-05 |