Issued Patents 2024
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170237 | Semiconductor structure and manufacturing method thereof | Wensen Hung, Ping-Kang Huang, Sao-Ling Chiu, Tsung-Yu Chen, Chien-Yuan Huang +1 more | 2024-12-17 |
| 12094836 | Semiconductor device having heat dissipation structure of curved profile and a manufacturing method thereof | Wensen Hung, Hsuan-Ning Shih, Hsien-Pin Hu, Tsung-Yu Chen, Wen-Hsin Wei | 2024-09-17 |
| 12080623 | Integrated circuit packages having mechanical brace standoffs | Yuan Sheng Chiu, Chih-Kai Cheng | 2024-09-03 |
| 12074154 | Package structure | Tsung-Yu Chen, Wensen Hung | 2024-08-27 |
| 12021006 | Package structure and method and equipment for forming the same | Wensen Hung, Tsung-Yu Chen, Chen-Hsiang Lao, Wen-Hsin Wei, Hsien-Pin Hu | 2024-06-25 |
| 11996342 | Semiconductor package comprising heat dissipation plates | Chen-Hsiang Lao, Yuan Sheng Chiu, Hung-Chi Li, Shih-Chang Ku | 2024-05-28 |
| 11955439 | Semiconductor package with redistribution structure and manufacturing method thereof | Wei-Cheng Wu, Chien-Chia Chiu, Cheng-Hsien Hsieh, Li-Han Hsu, Meng-Tsan Lee | 2024-04-09 |
| 11955401 | Package structure | Shih-Hui Wang, Der-Chyang Yeh, Shih-Peng Tai, Yi-Chung Huang | 2024-04-09 |
| 11929293 | Semiconductor package with lid structure | Wensen Hung, Tsung-Yu Chen | 2024-03-12 |
| 11923310 | Package structure including through via structures | Chih-Kai Cheng, Tsung-Yu Chen, Hsien-Pin Hu, Wen-Hsin Wei | 2024-03-05 |
| 11901320 | Contact pad for semiconductor device | Chang-Chia Huang, Cheng-Chieh Hsieh, Wei-Cheng Wu | 2024-02-13 |