Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125757 | Semiconductor package with stiffener structure and method forming the same | Wensen Hung, Yu-Ling Tsai, Tsung-Yu Chen | 2024-10-22 |
| 11955439 | Semiconductor package with redistribution structure and manufacturing method thereof | Wei-Cheng Wu, Cheng-Hsien Hsieh, Li-Han Hsu, Meng-Tsan Lee, Tsung-Shu Lin | 2024-04-09 |