Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125757 | Semiconductor package with stiffener structure and method forming the same | Wensen Hung, Chien-Chia Chiu, Tsung-Yu Chen | 2024-10-22 |
| 11984375 | Integrated circuit package and method | Chien-Hsun Chen, Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2024-05-14 |