Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183682 | Semiconductor package and manufacturing method thereof | Chien-Hsun Lee, Chung-Shi Liu, Jiun Yi Wu, Shou-Yi Wang, Tsung-Ding Wang | 2024-12-31 |
| 12080563 | Semiconductor devices and methods of manufacturing | Yu-Min Liang, Yen-Ping Wang, Jiun Yi Wu, Chen-Hua Yu, Kai-Chiang Wu | 2024-09-03 |
| 11984375 | Integrated circuit package and method | Yu-Ling Tsai, Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2024-05-14 |
| 11961814 | Integrated circuit package and method | Shou-Yi Wang, Jiun Yi Wu, Chung-Shi Liu, Chen-Hua Yu | 2024-04-16 |
| 11923315 | Semiconductor package and manufacturing method thereof | Chung-Hao Tsai, Chen-Hua Yu, Chuei-Tang Wang, Wei-Ting Chen, Shih-Ya Huang | 2024-03-05 |
| 11903707 | Enclosed desorption electrospray ionization probes and method of use thereof | Robert Graham Cooks, Zheng Ouyang, Ziqing Lin, Livia Schiavinato Eberlin | 2024-02-20 |