Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183682 | Semiconductor package and manufacturing method thereof | Chien-Hsun Chen, Chien-Hsun Lee, Chung-Shi Liu, Jiun Yi Wu, Tsung-Ding Wang | 2024-12-31 |
| 11961814 | Integrated circuit package and method | Chien-Hsun Chen, Jiun Yi Wu, Chung-Shi Liu, Chen-Hua Yu | 2024-04-16 |