Issued Patents 2024
Showing 1–25 of 125 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183700 | Semiconductor device package and method of manufacture | Jiun Yi Wu | 2024-12-31 |
| 12176282 | Manufacturing method of semiconductor package | Chung-Ming Weng, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo +7 more | 2024-12-24 |
| 12174415 | Semiconductor package and manufacturing method thereof | Chih-Chieh Chang, Chung-Hao Tsai, Chuei-Tang Wang | 2024-12-24 |
| 12170267 | Semiconductor device and method of manufacture | Jiun Yi Wu, Chung-Shi Liu | 2024-12-17 |
| 12164158 | Package having prism structure and manufacturing method thereof | Che-Hsiang Hsu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo +3 more | 2024-12-10 |
| 12165985 | Semiconductor device and method | Hui-Jung Tsai, Hung-Jui Kuo, Chung-Shi Liu, Han-Ping Pu, Ting-Chu Ko | 2024-12-10 |
| 12165941 | Semiconductor device and method of manufacture | Chien-Hsun Lee, Jiun Yi Wu | 2024-12-10 |
| 12159822 | Method of manufacturing a semiconductor package having conductive pillars | Jiun Yi Wu, Chung-Shi Liu | 2024-12-03 |
| 12159851 | Package structure having hollow cylinders and method of fabricating the same | Chung-Shi Liu, Hao-Yi Tsai, Tin-Hao Kuo | 2024-12-03 |
| 12159860 | Singulation and bonding methods and structures formed thereby | Tsang-Jiuh Wu, Wen-Chih Chiou | 2024-12-03 |
| 12148651 | Chuck design and method for wafer | Ming-Tan Lee, Hung-Jui Kuo | 2024-11-19 |
| 12147159 | Semiconductor device and method of manufacture | Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2024-11-19 |
| 12142597 | Integrated fan-out package and the methods of manufacturing | Kuo-Chung Yee, Hao-Yi Tsai, Tin-Hao Kuo | 2024-11-12 |
| 12142524 | Via for component electrode connection | Chi-Hsi Wu, Wen-Chih Chiou, Tsang-Jiuh Wu, Der-Chyang Yeh, Ming-Shih Yeh +1 more | 2024-11-12 |
| 12135454 | Structure and process for photonic packages | Hsing-Kuo Hsia, Kuo-Chiang Ting | 2024-11-05 |
| 12136612 | Three-dimension large system integration | Tin-Hao Kuo | 2024-11-05 |
| 12136593 | Electronic apparatus including antennas and directors | Tzu-Chun Tang, Chung-Hao Tsai, Chuei-Tang Wang, Che-Wei Hsu | 2024-11-05 |
| 12125812 | Integrated circuit packages and methods of forming the same | Chien-Yuan Huang, Shih-Chang Ku, Chuei-Tang Wang | 2024-10-22 |
| 12125794 | Semiconductor device and manufacturing method of semiconductor device | Chih-Hang Tung, Tung-Liang Shao, Su-Chun Yang, Wen-Lin Shih | 2024-10-22 |
| 12125798 | Semiconductor package and method | Jeng-Shien Hsieh, Chuei-Tang Wang, Chieh-Yen Chen | 2024-10-22 |
| 12119292 | Semiconductor device and method of manufacture | Jiun Yi Wu | 2024-10-15 |
| 12119303 | Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof | Chun-Lin Lu, Han-Ping Pu, Kai-Chiang Wu | 2024-10-15 |
| 12113005 | Packages with Si-substrate-free interposer and method forming same | Ming-Fa Chen | 2024-10-08 |
| 12105323 | Semiconductor package | Chung-Ming Weng, Hua-Kuei Lin, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh +5 more | 2024-10-01 |
| 12107051 | Method of forming semiconductor packages having through package vias | Chung-Shi Liu, Chih-Wei Lin, Ming-Da Cheng | 2024-10-01 |