Issued Patents 2024
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159839 | Semiconductor packages | Tzu-Sung Huang, Hsiu-Jen Lin, Hao-Yi Tsai, Ming Hung Tseng, Tsung-Hsien Chiang +1 more | 2024-12-03 |
| 12159851 | Package structure having hollow cylinders and method of fabricating the same | Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai | 2024-12-03 |
| 12142597 | Integrated fan-out package and the methods of manufacturing | Chen-Hua Yu, Kuo-Chung Yee, Hao-Yi Tsai | 2024-11-12 |
| 12136612 | Three-dimension large system integration | Chen-Hua Yu | 2024-11-05 |
| 12125804 | Semiconductor package and manufacturing method thereof | Wei-Kang Hsieh, Hao-Yi Tsai, Shih-Wei Chen | 2024-10-22 |
| 12087718 | Bump structure having a side recess and semiconductor structure including the same | Chih-Horng Chang, Chen-Shien Chen, Yen-Liang Lin | 2024-09-10 |
| 12080615 | Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors | Chen-Hua Yu, Kuo-Chung Yee, Hao-Yi Tsai | 2024-09-03 |
| 12074143 | Integrated circuit package and method | Chen-Hua Yu, Chi-Hui Lai, Hao-Yi Tsai, Chung-Shi Liu | 2024-08-27 |
| 12057405 | Packages with thick RDLs and thin RDLs stacked alternatingly | Po-Yuan Teng, Kuo Lung Pan, Yu-Chia Lai, Hao-Yi Tsai, Chen-Hua Yu | 2024-08-06 |
| 12051666 | Package structure and manufacturing method of package structure thereof | Po-Yuan Teng, Hao-Yi Tsai, Kuo Lung Pan, Sen-Kuei Hsu, Yi-Yang Lei +2 more | 2024-07-30 |
| 12040281 | Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof | Chuei-Tang Wang, Chen-Hua Yu, Chung-Shi Liu, Chih-Yuan Chang, Jiun Yi Wu +1 more | 2024-07-16 |
| 12014979 | Methods of forming semiconductor packages | Kuo Lung Pan, Shu-Rong Chun, Teng-Yuan Lo, Hung-Yi Kuo, Chih-Horng Chang +1 more | 2024-06-18 |
| 12014976 | Chip package structure including a silicon substrate interposer and methods for forming the same | Kuo Lung Pan, Yu-Chia Lai, Teng-Yuan Lo, Mao-Yen Chang, Po-Yuan Teng +3 more | 2024-06-18 |
| 12009281 | Package structure and method of manufacturing the same | Shih-Wei Chen, Hao-Yi Tsai, Kuo Lung Pan, Po-Yuan Teng, Chi-Hui Lai | 2024-06-11 |
| 11990381 | Integrated circuit packages having support rings | Shu-Rong Chun, Kuo Lung Pan, Hao-Yi Tsai, Pei-Hsuan Lee, Chien Ling Hwang +3 more | 2024-05-21 |
| 11961810 | Solderless interconnection structure and method of forming same | Yu-Wei Lin, Sheng-Yu Wu, Yu-Jen Tseng, Chen-Shien Chen | 2024-04-16 |
| 11923318 | Method of manufacturing semiconductor package | Tsung-Hsien Chiang, Hsien-Ming Tu, Hao-Yi Tsai | 2024-03-05 |
| 11923349 | Semiconductor structures | Chi-Hui Lai, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai | 2024-03-05 |
| 11908706 | Cross-wafer RDLs in constructed wafers | Chen-Hua Yu | 2024-02-20 |