Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12166015 | Semiconductor package and manufacturing method of semiconductor package | Hung-Yi Kuo, Hao-Yi Tsai, Kuo Lung Pan, Ting Hao Kuo, Yu-Chia Lai +3 more | 2024-12-10 |
| 12125804 | Semiconductor package and manufacturing method thereof | Hao-Yi Tsai, Tin-Hao Kuo, Shih-Wei Chen | 2024-10-22 |