Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12166015 | Semiconductor package and manufacturing method of semiconductor package | Wei-Kang Hsieh, Hung-Yi Kuo, Hao-Yi Tsai, Kuo Lung Pan, Ting Hao Kuo +3 more | 2024-12-10 |
| 12100682 | Package structure with conductive patterns in a redistribution layer | Chih-Horng Chang, Hao-Yi Tsai, Chih-Hsuan Tai | 2024-09-24 |
| 12057405 | Packages with thick RDLs and thin RDLs stacked alternatingly | Po-Yuan Teng, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Chen-Hua Yu | 2024-08-06 |
| 12014976 | Chip package structure including a silicon substrate interposer and methods for forming the same | Kuo Lung Pan, Teng-Yuan Lo, Mao-Yen Chang, Po-Yuan Teng, Chen-Hua Yu +3 more | 2024-06-18 |
| 11990381 | Integrated circuit packages having support rings | Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Pei-Hsuan Lee +3 more | 2024-05-21 |
| 11942451 | Semiconductor structure and method of forming the same | Mao-Yen Chang, Cheng-Shiuan Wong, Ting Hao Kuo, Ching-Hua Hsieh, Hao-Yi Tsai +2 more | 2024-03-26 |