Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12100682 | Package structure with conductive patterns in a redistribution layer | Yu-Chia Lai, Hao-Yi Tsai, Chih-Hsuan Tai | 2024-09-24 |
| 12087718 | Bump structure having a side recess and semiconductor structure including the same | Tin-Hao Kuo, Chen-Shien Chen, Yen-Liang Lin | 2024-09-10 |
| 12014979 | Methods of forming semiconductor packages | Kuo Lung Pan, Shu-Rong Chun, Teng-Yuan Lo, Hung-Yi Kuo, Tin-Hao Kuo +1 more | 2024-06-18 |
| 11915994 | Package structure comprising a semiconductor die with a thermoelectric structure and manufacturing method thereof | Cheng-Yen Hsieh, Chung-Yu Lu | 2024-02-27 |