Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11915994 | Package structure comprising a semiconductor die with a thermoelectric structure and manufacturing method thereof | Chih-Horng Chang, Chung-Yu Lu | 2024-02-27 |
CH
Cheng-Yen Hsieh
Overall (2024): #512,438 of 561,600Top 95%
1
Patents 2024