Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12113027 | Three-dimensional integrated circuit structures and methods of forming the same | Ping-Kang Huang, Sao-Ling Chiu | 2024-10-08 |
| 11915994 | Package structure comprising a semiconductor die with a thermoelectric structure and manufacturing method thereof | Cheng-Yen Hsieh, Chih-Horng Chang | 2024-02-27 |
| 11901306 | Semiconductor structure | Yao-Jen Chang, Sao-Ling Chiu | 2024-02-13 |